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1

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 22 February 2015)] Advanced Etch Technology for Nanopatterning IV - Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)

Lin, Qinghuang, Engelmann, Sebastian U., Zhang, Ying, Feurprier, Yannick, Lutker-Lee, Katie, Rastogi, Vinayak, Matsumoto, Hiroie, Chiba, Yuki, Metz, Andrew, Kumar, Kaushik, Beique, Genevieve, Labonte,

Year:

2015

Language:

english

File:

PDF, 2.57 MB

english, 2015

2

Reaction kinetics of chlorine on Si(111)7 × 7 surfaces

Jiro Matsuo, Feurprier Yannick, Kazuhiro Karahashi

Journal:

Surface Science Letters

Year:

1993

Language:

english

File:

PDF, 73 KB

english, 1993

3

Reaction kinetics of chlorine on Si(111)7 × 7 surfaces

Jiro Matsuo, Feurprier Yannick, Kazuhiro Karahashi

Journal:

Surface Science

Year:

1993

Language:

english

File:

PDF, 514 KB

english, 1993

4

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 21 February 2016)] Advanced Etch Technology for Nanopatterning V - Plasma etch patterning of EUV lithography: balancing roughness and selectivity trade off

Lin, Qinghuang, Engelmann, Sebastian U., Rastogi, Vinayak, Beique, Genevieve, Sun, Lei, Cottle, Hongyun, Feurprier, Yannick, Metz, Andrew W., Kumar, Kaushik A., Labelle, Catherine, Arnold, John, Colbu

Year:

2016

Language:

english

File:

PDF, 2.15 MB

english, 2016

5

SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 26 February 2017)] Advanced Etch Technology for Nanopatterning VI - Self-aligned block technology: a step toward further scaling

Engelmann, Sebastian U., Wise, Rich S., Lazzarino, Frédéric, Mohanty, Nihar, Feurprier, Yannick, Huli, Lior, Luong, Vinh, Demand, Marc, Decoster, Stefan, Vega Gonzalez, Victor, Ryckaert, Julien, Kim,

Year:

2017

Language:

english

File:

PDF, 5.02 MB

english, 2017